November 11, 2011
IKE adds world class automatic assembly equipment
IKE Micro has purchased and installed a Hesse and Knipps BJ 820 automatic wedge/ribbon bonder and a Datacon 2200 EVO automated die attach work cell. IKE has had very good success with the first H and K bonder purchased 3 years ago. It has enabled IKE to automate applications requiring .0007″ – .001″ wire, both aluminum and gold, and also .003″ and .005″ gold ribbon. The new BJ820 has improved capabilities and will help minimize machine change over as we add additional build to print products. The Datacon work cell has 3 different epoxy dispense methods, and can place die from wafer, waffle pack and gel pack with full pattern recognition, 360 die orientation, 10 micron accuracy and full touch down control. Coupled with the Palomar 8000 automatic ball bonder, IKE now has the most comprehensive built to print capability in the Northeast.
July 26, 2011
IKE Micro books LED contracts
IKE Micro received orders from three customers in the opto-electronics market. The build to print manufacturing orders incorporate the direct die attach and wire bonding of LED devices, the surface mount of packaged LEDs, the application of optical epoxies, and optical dome attachment. The orders will be completed in Q3 2011, and transition to turnkey orders in Q3 and Q4.
May 16, 2011
IKE Micro buys new inspection system.
IKE Micro and its sister company Bonding Source have purchased and installed a MicroVu Vertex Measuring Center. The vision inspection system is extremely precise in the X, Y, and Z axis. It has an inspection area of 12” x 12” x 6”. Once programmed the MicroVu System automatically scans the part and provides data for all measurements and highlights any measurement out of tolerance. The system can also be operated in a manual mode.
IKE Micro is using the Measuring Center for the incoming inspection of circuit boards, substrates, carriers and other piece parts, and the in-process and final inspection of component placement, wire bond lengths and loop heights. The system is also being used to capture digital photos of microelectronics and RF/Microwave assemblies. Bonding Source uses the system to inspect laser cut epoxy pre-forms.
