Wire Bonding
- Ball Bonding – Automatic and manual gold ball bonding from .0008″ to .002″. Palomar 8000 and K & S 1419 automatic bonders, Mechel manual bonders.
- Wedge Bonding – Automatic and manual gold and aluminum wedge bonding from .0007″ to .015″. deep access/vertical feed capability. Hesse and Knipps BJ715/BJ820, and K & S 1470 automatic bonders, Westbond Manual bonders.
- Ribbon – Automatic and manual ribbon bonding from .002″ to .010″, deep access/vertical feed capability. Hesse and Knipps BJ715/BJ820 automatic bonders, and Westbond manual bonders.
IKE Micro has extensive experience wire bonding MMICs, diodes, transistors and other components along RF lines. All wire bonding personnel are certified to MIL-STD 883 workmanship criteria.
Component Attach- Epoxy
Automatic conductive and non-conductive epoxy dispensing with Datacon EVO precision dispensing and daubing from epoxy well. Camalot epoxy dispensing systems and CW Price Screen Printers. Automatic component placement with Datacon EVO and Quad APS Hybrid die placement machines; including MMIC’s, FETs, diodes, and passive devices. 360 degree die orientation with .0005″ post bond tolerance. Manual epoxy and die placement using Westbond 7372 and 4200 semi-automatic die attach machines. All die attach personnel are certified to MIL-STD 883 workmanship criteria. Flexible epoxy cure schedules to match component and assembly heating limitations.
Component Attach – Solder
Solder Deposition of tin lead and lead free solder pastes via stencil printing, and automatic and manual dispensing. Automatic placement of components with Mydata and Quad Pick and Place equipment and/or manual placement. Reflow with Heller 1500W 10 zone convection, Sikama 3 zone conductive oven, or hot plates. Gold/Tin, Gold/Germanium and eutectic die attach on Mechel hot gas die bonders.
Encapsulation/Glob Top/Optical Coating
Encapsulation of wire bonded devices using dam and fill or glob top dispense technologies. Dam and fill/glob top done automatically on Camalot epoxy dispense machines and Datacon . Manual dam and fill and glop top using EFD dispensers. Application of optical gels and epoxies using both manual and automatic dispensing.
Cleaning/Solder
Profile controlled vapor degreaser, using Lenium solvent for effective cleaning and removal of all flux residue, for ultra-clean IPC-A-610, Class 3 acceptability criteria.
Hand Soldering
Hand soldering of feedthrus, small gauge wires and coils, ribbons, transformers, mixer diode assemblies, connectors, and all types of surface mount and thru-hole components, wiring and ECO modifications. All soldering personnel are certified to IPC-A-610 Class 3 workmanship standards.
Substrate Attach
Substrate (thick film, thin film, LTCC, FR4, duroid, and flex circuits) attached to carriers with epoxy film/pre-forms, epoxy paste, solder preforms, or solder paste. Epoxy board mount units are cured with custom board mount fixturing with PSI verified by load cell to insure repeatability. Large area, digitally controlled hot plate or Heller 1500W 10 zone reflow oven is used for solder board mount processing . Bondtec System used for solder attach of substrates using Gold/Tin and Gold/Germanium pre-forms.
Feedthru Installation
Installation of feedthrus, using various solder alloys, on feedthru resistance soldering station, and/or reflow with fixturing on hot plate and Heller 1500 oven. Non-hermetic feedthru installation with conductive and non-conductive epoxies.
Open Package Leak Testing
Open package leak testing using Varian Helium leak detector for verification of hermetic feedthru installation
Plasma Cleaning
Plasma cleaning with high purity argon of substrates and assembled devices to remove organic contaminants prior to bonding.
Wire Bond Pull Test Certifications
IKE Micro provides destructive and non-destructive wire bond pull testing services using automatic or manual wire bonders. Bond pull machines are certified to meet MIL-STD requirements.
Thermo-sonic Tacking/Gap Welding
Thermo-compression and thermo-sonic bonding of coils, ribbon, and beam lead devices on Westbond machines. Gap welding on Unitek Light Force Weld Head. Resistance welding on Unitek 80EZ Air Actuated Weld Head
Integration
Mechanical integration of subassemblies utilizing solders, preforms, epoxies, and various hardware.
Inspection
- “First Piece” policy on all assembly processes.
- In process QC inspection on multi-step assemblies.
- 100% final inspection on all assemblies.
- Inspection personnel are certified to IPC-A-610 and MIL-STD 883 visual acceptance criteria.
- High power scopes for die inspection services.
- Testing
IKE Micro provides test services for most products. Please call for details.
