IKE Micro operates from a leased 14,000 square foot facility in Nashua, NH. The facility was completely refurbished and fit-up to meet our specifications. The space includes a 3,250 sq. ft. Class 10,000 Clean Room with ESD flooring, a SMT and hand soldering area with ESD flooring, a stockroom to support both consignment and turnkey builds, and 3 other manufacturing areas for proprietary manufacturing and expansion. We are proponents of the “5 S’s”, and maintain a clean, organized, and safe work environment. If warranted we will set up work cells and exclusive equipment to support specific programs. All employees complete formal ESD training, and check heel and wrist straps daily. Equipment calibration is performed annually on site. There is an extensive in-house preventive maintenance program for all serviceable equipment.
Below is a partial list of equipment used in our manufacturing operation:
| Quantity | Description |
|---|---|
| 1 | Datacon 2200 EVO Twin Head Mult-chip die bonder, picks from wafer, gel packs, waffle packs, precision dispensing, pin transfer, pattern recognition, 10um accuracy. for Datacon info click here |
| 1 | Quad APS-1H Automatic Tape and Reel SMT and bare die placement machine, 58 waffle pack trays, 360 degree die orientation, for Quad APS info click here |
| 1 | Mydata TP9 Pick & Place, Tape and Reel, BGA’s, 0402′s |
| 1 | Hesse & Knipps Bondjet 715 Automatic wedge/ribbon bonder,.0007″ wire to .010″ ribbon, deep access, for H and K 715 Bondjet info click here |
| 1 | Hesse & Knipps Bondjet BJ 820 Automatic wedge/ribbon bonder,.0007″ wire to .010″ ribbon, deep access, for Bondjet BJ820 info click here |
| 1 | Palomar 8000 High Speed, Deep Access Automatic Ball Bonder. Hybrids, Multi-Chip Modules, Sensors, Chip on Board, Chip on Flex, for Palomar 8000 click here |
| 2 | Camalot 1818 Epoxy/Solder Dispensing Systems Dual Heads, Positive Displacement Pumps, Heated Work Stages |
| 1 | Heller 1500W Convection Reflow Oven 11 foot, 10 zone, tin/lead and lead free capable |
| 1 | DeHaart Screen Printer with Dual Vision |
| 2 | C.W. Price Screen Printer |
| 2 | K&S 1419 Automatic Gold Ball Bonder set up for hybrids |
| 1 | K&S 1470 Automatic Gold and Aluminum Deep Access Wedge Bonder |
| 3 | Mechel Gold Ball Bonders |
| 1 | Mechel Deep Access Wedge Bonder |
| 1 | Westbond High Frequency Wedge Bonder (Duroid Bonding) |
| 1 | Westbond .0007″ Wedge Bonder |
| 1 | Westbond Gold Ribbon Bonder |
| 2 | Westbond Deep Access Wedge Bonder |
| 2 | Westbond .001″ Gold Wedge Bonder |
| 1 | Westbond Thermosonic “Tacker”, Beam Leads and Coils |
| 1 | Westbond Aluminum Wedge Bonders |
| 1 | Orthodyne Large Wire Aluminum Bonder |
| 1 | Unitek Phase Master IV Light Force Welder |
| 1 | Unitek Model 80 Thin Line Resistance Welder |
| 2 | Dage Bond Pull Tester |
| 2 | Mechel Eutectic Die Attach Station |
| 6 | Westbond Semi-Automatic Epoxy Die Attach Stations |
| 1 | LFE Plasma Cleaner, High Purity Argon |
| 5 | Blue M, Yamato, Hotpack Curing Ovens, 25c – 300c |
| 1 | DYMAX UV Light Curing Flood Lamp System |
| 1 | Sikama Three Stage Belt Reflow Oven |
| 1 | Branson 250 Degreaser with automatic robotic arm to control cleaning profile |
| 1 | Varian 959 DP Helium Leak Detector |
| 6 | EFD or equivalent manual dispense stations |
| 1 | STI 12″ x 12″ digitally controlled hot plate for solder board mount operation |
| 1 | High Power Resistance Soldering Station for feedthru installation and rework |
| 15 | Hot Plates, Ewald and STI |
| 10 | Solder Stations, Metcal, Ungar and Haiko |
| 2 | Solder Pots |
| 1 | Nikon High Power Inspection Scope |
| 2 | Unitron Inspection Scopes |
| 34 | B&L Microscopes |
| 1 | Midas Hot Gas Repair Station |
| 1 | Nitrogen Glove Box |
| 1 | Particle Counter |
| 22 | Experienced, cross-trained and certified awesome employees |
